Canada
PhD in Optimization of Micropillar Microfabrication for Fan-Out Wafer Level Packaging
Université de Sherbrooke · Canada
Microelectronics and Materials Engineering
Due Dec 30 · 77d
PhD positions at Université de Sherbrooke
3 catalogue listings · verify admissions with the source
Canada
PhD in New Metallurgies for Low-Temperature Hybrid Bonding in Fan-Out Wafer Level Packaging
Université de Sherbrooke · Canada
Materials Science and Microelectronics Engineering
Due Dec 30 · 77d
Canada
PhD Opportunity in Materials and Semiconductor Engineering
Université de Sherbrooke · Canada
Engineering
Due Dec 3 · 50d